CLPA highlights how TSN can turbocharge automotive manufacturing

As a Platinum sponsor of the Innovative Car Manufacturing (ICM) Summit 2022, the CC-Link Partner Association (CLPA) will showcase the benefits of Time-Sensitive Networking (TSN) technology for automotive manufacturing. Attendees to the ICM Summit, which will take place on 21st March, will be able to learn how TSN can advance their operations to drive up productivity and efficiency.

The ICM Summit provides a key platform to explore new technologies and trends that can help European car manufacturers deliver high quality products, improve operations and unlock new business opportunities. One of the most promising innovations is TSN, which enables the next-level network communications needed for the Connected Industries of the future.

The CLPA will contribute to the discussions at the summit as a global leader in developing open industrial network technologies designed to accelerate the realisation of smart factories. The organisation will highlight the opportunities offered by CC-Link IE TSN, the first industrial Ethernet to combine gigabit bandwidth with TSN functions, to companies across the entire automotive value chain. From 9:20 AM, attendees will be invited to join a presentation given by Christoph Behler, Business Development Manager at the CLPA, on the benefits of implementing TSN-driven network technologies.

The presentation will also provide an overview of the Mitsubishi Electric’s TSN-compatible industrial automation solutions. This is one of the largest and most comprehensive TSN-based offerings currently available. As a result, attendees will be able to understand the breadth of this offering and how it can address the challenges they may be facing in their own plants.

Lucas Majewski, Global Key Account Management - Automotive Director at Mitsubishi Electric, explains: “We look forward to increasing the awareness of TSN and its benefits for the automotive industry. This is the only technology that can support a converged, simplified network architecture for Industry 4.0 applications in electric vehicle manufacturing. To make TSN applications more accessible and successfully support practically any end use, we provide a wide range of CC-Link IE TSN compatible devices. Companies can greatly enhance their competitiveness by adopting these solutions now.”

John Browett, General Manager at CLPA Europe, comments: “We are delighted to be part of the ICM Summit, as the event provides a key forum to discuss how manufacturing activities can be advanced with TSN-based technologies, such as CC-Link IE TSN. Exactly because we believe TSN offers tremendous advantages to businesses in the sector, we have also taken the steps to contribute to the success of the event by being a top-level sponsor with our board member Mitsubishi Electric. We invite anyone interested in learning what the key benefits of TSN are to join our presentation.”

Attend the CLPA’s presentation during the ICM Summit, on 21st March 2022, at the Hilton Munich Park, Munich (Germany) to discover what CC-Link IE TSN can do for the automotive industry:

About The CC-Link Partner Association (CLPA)

The CLPA is an international organisation founded in 2000 dedicated to the technical development and promotion of the CC-Link family of open automation networks. The CLPA's key technology is CC-Link IE TSN, the world's first open industrial Ethernet to combine gigabit bandwidth with Time Sensitive Networking (TSN), making it the leading solution for Industry 4.0 applications. Currently the CLPA has over 3,800 member companies worldwide, and more than 2,000 compatible products available from over 300 manufacturers. Over 26 million devices using CLPA technology are in use worldwide.

Editorial contact:

DMA Europa Ltd: Chiara Civardi
Tel: +44 (0)1562 751436 Fax: +44 (0)1562 748315
Web: Email:

Company contact:

CLPA-Europe: John Browett
Tel: +44 (0) 7768 338708 Fax: +49 (0) 2102 532 9740
Web: Email:

The CLPA is presenting the benefits of Time-Sensitive Networking (TSN) for the automotive industry at the ICM Summit, taking place on 21st March 2022.